JPH036410Y2 - - Google Patents

Info

Publication number
JPH036410Y2
JPH036410Y2 JP1985158214U JP15821485U JPH036410Y2 JP H036410 Y2 JPH036410 Y2 JP H036410Y2 JP 1985158214 U JP1985158214 U JP 1985158214U JP 15821485 U JP15821485 U JP 15821485U JP H036410 Y2 JPH036410 Y2 JP H036410Y2
Authority
JP
Japan
Prior art keywords
cavity
insert
mold
cheese
attached
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1985158214U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6265214U (en]
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985158214U priority Critical patent/JPH036410Y2/ja
Publication of JPS6265214U publication Critical patent/JPS6265214U/ja
Application granted granted Critical
Publication of JPH036410Y2 publication Critical patent/JPH036410Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP1985158214U 1985-10-16 1985-10-16 Expired JPH036410Y2 (en])

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985158214U JPH036410Y2 (en]) 1985-10-16 1985-10-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985158214U JPH036410Y2 (en]) 1985-10-16 1985-10-16

Publications (2)

Publication Number Publication Date
JPS6265214U JPS6265214U (en]) 1987-04-23
JPH036410Y2 true JPH036410Y2 (en]) 1991-02-19

Family

ID=31081493

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985158214U Expired JPH036410Y2 (en]) 1985-10-16 1985-10-16

Country Status (1)

Country Link
JP (1) JPH036410Y2 (en])

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2635193B2 (ja) * 1990-01-23 1997-07-30 三菱電機株式会社 半導体装置の樹脂封止装置、樹脂封止方法及び樹脂封止型半導体装置
JP4568258B2 (ja) * 2006-09-13 2010-10-27 住友重機械工業株式会社 モールド金型及びモールド方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5335960U (en]) * 1976-09-02 1978-03-29

Also Published As

Publication number Publication date
JPS6265214U (en]) 1987-04-23

Similar Documents

Publication Publication Date Title
KR100193591B1 (ko) 수지몰드장치 및 수지몰드방법
US5204122A (en) Mold for use in resin encapsulation molding
US5108278A (en) Resin sealing apparatus
JPH036410Y2 (en])
TW202241686A (zh) 成型模、樹脂成型裝置及樹脂成型品之製造方法
US5281121A (en) Resin sealing apparatus
JP2626971B2 (ja) 電子部品の樹脂封止成形方法及び金型
JPH0414177Y2 (en])
JPH043768Y2 (en])
JP2992982B2 (ja) 電子部品の樹脂封止部成形用金型装置
JPS6058813A (ja) 成形型
JPS62128721A (ja) 樹脂成形方法
JPH11333882A (ja) 半導体装置の樹脂封止用金型
JPH0586732B2 (en])
JPH0414178Y2 (en])
JPH0620578Y2 (ja) 半導体射出成型機
JPH1022314A (ja) 半導体樹脂封止用金型
KR100536129B1 (ko) 인서트물을 삽입하는 박막제품의 사출성형방법 및 그방법으로 제조한 박막제품
JPS6279632A (ja) 樹脂封止装置
JPH06314717A (ja) 離型荷重測定用金型とこれを用いた離型荷重測定方法
KR920001987Y1 (ko) 반도체칩의 컴파운드성형모울드
JPH10284527A (ja) 電子部品の樹脂封止成形方法及び金型
JPH0642336Y2 (ja) 半導体素子の樹脂封止装置
JP2956047B2 (ja) 電子部品の樹脂封止部成形用金型装置
JPS6214688Y2 (en])